Application of Simulation Technology to Thermal Issues

摘要

Electronic equipment has reduced in size and advanced in processing speed. As the heat density of such equipment has increased, conventional thermal designs do not always meet the temperature specification requirements any more. To meet these specifications, SimDesign Techno-Center has been working on the improvement of thermal simulation technology. This paper describes the latest technology in thermal design along with some product design examples particularly in the following four cases: 1) thermal design using copper trace models on a printed circuit board, 2) thermal design concerning solar radiation, 3) thermal design most suitable for electric wire, and 4) manufacturing support by using thermal simulation to determine the temperature profile of the reflow furnace. The cost effectiveness of the thermal simulation is also proved in practice.