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Production of fine spherical lead-free solder powders by hybrid atomization

机译:通过混合雾化生产精细的球形无铅焊料粉

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Considerable R&D efforts in last decade have identified several promising lead-free tin alloys for the replacement of lead-containing solders in microelectronic applications. However, it is difficult or uneconomical to produce high-quality solder balls industrially by means of conventional atomization methods. To produce acceptable lead-free solder balls efficiently and industrially, a novel powder-making process change to active voice. Hybrid Atomization that combines free fall gas atomization and centrifugal atomization effectively, was invented and developed recently by us. This new technique can produce very fine, spherical tin alloy powders with mean diameters of about 10 μm, very narrow size distributions, few satellites and low production costs. Taking Sn-9mass%Zn alloy as an example, process experiments were carried out and the optimal processing conditions obtained. Results show that the influences of processing parameters and optimum conditions are very different from those in conventional atomization processes. The spherical powder with a mean particle size of 10.6 μm and a standard deviation of 1.3—1.7 μm was obtained in the determined optimum condition.
机译:在过去的十年中,大量的研发工作已经确定了几种有前途的无铅锡合金,可替代微电子应用中的含铅焊料。然而,通过常规的雾化方法在工业上生产高质量的焊球是困难的或不经济的。为了高效,工业地生产可接受的无铅焊锡球,一种新颖的制粉工艺变成了活跃的声音。我们最近发明并开发了将自由落体气体雾化和离心雾化有效结合的混合雾化。这项新技术可以生产出非常细小的球形锡合金粉末,平均直径约为10μm,尺寸分布非常窄,人造卫星数量少,生产成本低。以Sn-9质量%Zn合金为例,进行了工艺实验,获得了最佳工艺条件。结果表明,工艺参数和最佳条件的影响与常规雾化工艺有很大不同。在确定的最佳条件下,获得的球形粉末平均粒径为10.6μm,标准偏差为1.3-1.7μm。

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