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首页> 外文期刊>Rheologica Acta >Temperature profiles in a controlled-stress parallel plate rheometer
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Temperature profiles in a controlled-stress parallel plate rheometer

机译:受控应力平行板流变仪中的温度曲线

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Actual melt temperatures are rarely measured directly when conducting rheological characterisations of materials in non-ambient conditions despite the potentially large influence temperature may have on the rheological data. For rheometers that use only a temperature-regulated lower plate, it is likely that the set point and true melt temperatures differ, an effect that becomes significant when characterising melts or suspensions close to phase-change events like crystallisation. This work investigates the magnitude of these effects for a controlled-stress rheometer featuring a temperature-controlled lower plate. The lower plate was fitted with a serrated cover disc that was found to exacerbate temperature deviations from the desired set point. Steady-state radial and vertical temperature profiles within the sample were measured and compared with the predictions of a finite element analysis model. The deviations between set point and measured temperatures were successfully predicted by the simulation for two typical gap heights for a thermoplastic, ceramic paste. The non-ideal heat transfer characteristics were also investigated numerically for a representative polymer system that demonstrated the increased deviations from ideal values for lower thermal conductivity materials.
机译:在非环境条件下进行材料的流变表征时,很少实际直接测量实际熔体温度,尽管温度可能会对流变数据产生较大影响。对于仅使用温度可调节的下板的流变仪,设定点和实际熔体温度可能会有所不同,当表征接近相变事件(如结晶)的熔体或悬浮液时,这种影响将变得尤为明显。这项工作研究了具有温度控制下板的控制应力流变仪的这些影响的大小。下部板上装有锯齿形盖盘,发现该盖盘会加剧与所需设定点的温度偏差。测量了样品中稳态的径向和垂直温度曲线,并将其与有限元分析模型的预测结果进行了比较。通过对热塑性陶瓷糊料的两个典型间隙高度的仿真,成功地预测了设定点与测量温度之间的偏差。还对代表聚合物体系的非理想传热特性进行了数值研究,该体系表明较低导热系数的材料与理想值的偏差增加。

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