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Research Disclosure

机译:研究披露

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摘要

According to an aspect of the present invention, there is provided a clamp assembly, the clamp assembly comprising a clamp configurable to clamp a support member to a lower base surface of the clamp by electrostatic adhesiun. and an arrangement configurable to direct a gas to the lower base surface of the clamp, wherein the arrangement is configurable to humidify the gas by exposing the gas to a liquid. Advantageously, a humidified gas may more effectively discharge the lower base surface of the clamp than a non-humidified gas. The clamp may be configurable to clamp an article to an upper base surface of the clamp by electrostatic adhesion. Advantageously, this electrostatic clamping may enable clamping a substrate in vacuum. The arrangement may be configurable to condense at least a part of the liquid on the lower base surface of the clamp and to remove the at least a part of the liquid from the lower base surface of the clamp. The arrangement may be configurable to maintain a pressure of the gas at or above a first threshold, wherein the first threshold corresponds to a pressure that equals 80% of a vapor pressure of the liquid at a temperature of the lower base surface of the clamp. Alternatively the first threshold may correspond to a pressure that equals 90% or 100% of a vapor pressure of the liquid at a temperature of the lower base surface of the clamp. The percentage may depend on the lower base surface condition to condense at least part of the liquid on the lower base surface of the clamp. Advantageously, maintaining a pressure of the gas at or above this threshold may result in condensation of the liquid forming on the lower base surface of the clamp, which may accelerate discharging of the lower base surface. The arrangement may be configurable to maintain a pressure of the gas at or below a second threshold, wherein the second threshold corresponds to a pressure sufficient to move or lift the clamp with respect to the assembly. The arrangement may be configurable to remove the humidified gas from the lower base surface of the clamp. Advantageously, this may remove a residual charge from the lower base surface of the clamp. The lower base surface of the clamp may be provided with an opening configured to direct the humidified gas out of the opening. The arrangement may comprise a pump. The arrangement may comprise at least one pressure sensor. The arrangement may comprise a controller. The controller may be communicably coupled in the pump and the pressure sensor. The arrangement may comprise a reservoir for the liquid. The arrangement may he configurable to expose the gas to the liquid by directing the gas through the reservoir. The lower base surface of the clamp may comprise at least one burl. The at least one burl may define at least one channel between the clamp and a support member. An upper surface of the support member may be provided with an opening configured to direct the humidified gas out of the opening. The clamp assembly may comprise one or more fluid conduits. The arrangement may be configurable to direct the gas into the at least one channel via the one or more fluid conduits. The clamp may be configurable to be coupled to the support member by electrostatic adhesion. According to a further aspect of the present invention, there is provided a method of discharging a lower base surface of a clamp. wherein the clamp is configurable to clamp a support member to the lower base surface of the clamp by eleclroslalic adhesion, and wherein the method comprises the steps of: humidifying the gas by exposing the gas to a liquid; and directing the humidified gas to the lower base surface of the clamp. The method may further comprises a step of pressurizing the gas to between a first and a second threshold, wherein the first threshold is 80% or 90% or 100% of a vapor pressure of the gas at a temperature of the lower base surface of the clamp, and the second threshold is a pressure sufficient to move or lift the clamp with respect to the support member or the assembly. The method may further comprise a step, e.g. a subsequent step, of removing the humidified gas from the lower base surface of the clamp. The step of exposing the gas to a liquid may comprise directing the gas through a reservoir of the liquid. The liquid may comprises at least one of water and/or isopropanol alcohol. The lower base surface of the clamp may be discharged after the article has been removed from the upper base surface of the clamp.
机译:根据本发明的一个方面,提供了一种夹具组件,该夹具组件包括夹具,该夹具通过静电粘合来夹紧支撑构件到夹具的下部基础表面上。并且可配置以将气体引导到夹具的下基面上的布置,其中该装置可配置为通过将气体暴露于液体来加湿气体。有利地,加湿气体可以更有效地排出夹具的下部基表面而不是非加湿气体。夹具可以是可配置的,以通过静电粘附将物品夹紧到夹具的上基表面。有利地,该静电夹紧可以使得能够在真空中夹紧基板。该布置可以是可配置的,以将液体的至少一部分冷凝在夹具的下部基面上并从夹具的下部基面上移除液体的至少一部分。该布置可以是可配置的,以保持在第一阈值或高于第一阈值的气体的压力,其中第一阈值对应于夹具的下基表面的温度下等于液体的蒸气压的80%的压力。或者,第一阈值可以对应于在夹具的下基表面的温度下等于液体的蒸气压的90%或100%的压力。百分比可以取决于下基表面条件,以冷凝夹具的下部基面上的液体的至少一部分。有利地,在该阈值处保持气体的压力可以导致夹在夹具的下部基面上的液体的冷凝,这可以加速下基面的放电。该布置可以是可配置的,以维持在第二阈值处或低于第二阈值的气体的压力,其中第二阈值对应于足以移动或提起夹具的压力相对于组件。该布置可以是可配置的,以从夹具的下部基面上移除加湿气体。有利地,这可以从夹具的下基面上移除残余电荷。夹具的下基表面可以设置有开口,该开口被配置为将加湿气体引导出开口。该装置可包括泵。该装置可包括至少一个压力传感器。该装置可以包括控制器。控制器可以在泵和压力传感器中可通信地连接。该装置可包括用于液体的储存器。该装置可以通过将气体引导通过储存器来配置,以便可以配置以使气体暴露于液体上。夹具的下部基表面可包括至少一个脉冲。至少一个Burl可以限定夹具和支撑构件之间的至少一个通道。支撑构件的上表面可以设置有开口,该开口被配置为将加湿气体引导出开口。夹具组件可包括一个或多个流体导管。该装置可以是可配置的,以通过一个或多个流体导管将气体引导到至少一个通道中。可以通过静电粘合来配置夹具以连接到支撑构件。根据本发明的另一方面,提供了一种排出夹具的下基部表面的方法。其中夹具可配置成通过elecloslalic附着力将支撑构件夹在夹具的下部基面上,并且其中该方法包括以下步骤:通过将气体暴露于液体来加湿气体;并将加湿气体引导到夹具的下部基面。该方法还可以包括将气体加压到第一和第二阈值之间的步骤,其中第一阈值是气体在下部基础表面的温度下的气体蒸气压的80%或90%或100%。夹具,第二阈值是足以移动或抬起夹具相对于支撑构件或组件的压力。该方法可以进一步包括步骤,例如步骤。随后的步骤,其从夹具的下部基面上除去加湿气体。将气体暴露于液体的步骤可包括将气体引导通过液体的储存器。液体可包含至少一种水和/或异丙醇醇。在从夹具的上基表面移除后,夹具的下部基表面可以排出。

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    《Research Disclosure》 |2021年第681期|381-393|共13页
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