Effect of Ti Content on Properties of Al-Ti Alloy Film for Address Lines of TFT-LCDs

摘要

Employing pure aluminum for address lines of TFT-LCDs has a severe problem of hillock formation at elevated temperature. However, in the case of large TFT-LCDs more than 254 mm, it is impossible to use refractory metals for address lines because of their high resistivity. The Sl-Ti alloy films for ad- dress lines of TFT-LCDs were studied and it was found that AL-Ti alloy film has excellent resistance of Al-Ti alloy to hillocks. The effect of Ti content on properties of Al-Ti alloy film was investigated.