RELIABILITY ISSUES IN HYBRID OPTOELECTRONIC INTERCONNECT SYSTEMS

摘要

New technologies such as optical interconnects have been developed to realize very high speeds and massive data throughput. However, key reliability problems must be solved before commercialization occurs. Addressing the reliability issue, this paper presents the performance degradation of hybrid optoelectronic interconnect systems due to coefficient of thermal expansion mismatch between the optoelectronic component and the microlens and low cycle thermal fatigue of flip-chip solder bond between the photodiode array and the receiver electronic circuitry.