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Effect of post-cure on adhesively bonded functionally graded joints by induction heating

机译:后固化对感应加热粘合功能梯度接头的影响

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Functionally graded joints with an adhesive functionally modified by induction heating confer a more uniform stress distribution along the overlap and reduce the stress concentrations located at the ends of the overlap. The adhesive stiffness varies gradually along the overlap, being maximum in the middle and minimum at the ends of the overlap. This work studies the effect of post-curing on functionally graded joints obtained by induction heating. The performance of functionally graded joints, when submitted to different post-cure temperatures, was experimentally tested. Three different post-curing conditions were considered, with temperatures above and below the glass transition temperature of the fully cured network, T-g. The functionally graded joints (with and without post-cure) were compared with joints cured isothermally (with and without post-cure). The cure temperature values applied to the ends and to the middle of the graded joint are the same temperatures used to cure the isothermally cured joints. Analytical modelling was used to predict the failure load and to assess the effectiveness of the graded joint concept. The functionally graded joints subjected to post-cure at low temperatures (below T-g) show a slight decrease of the strength and the joints cured isothermally show a slight increase of the strength. With increase of the post-cure temperature (above T-g) the functionally graded joints exhibit strength similar to that of the joints cured isothermally. However, even for the highest post-cure temperatures, the functionally graded joints have a slightly higher strength.
机译:具有通过感应加热功能改性的粘合剂的功能梯度接头可沿重叠部分赋予更均匀的应力分布,并减少位于重叠部分末端的应力集中。粘合刚度沿着重叠部分逐渐变化,在重叠部分的中间最大,在末端最小。这项工作研究了后固化对通过感应加热获得的功能梯度接头的影响。当经受不同的后固化温度时,对功能梯度接头的性能进行了实验测试。考虑了三种不同的后固化条件,温度高于或低于完全固化网络的玻璃化转变温度T-g。将功能分级的关节(有和没有后固化)与等温固化的关节(有和没有后固化)进行了比较。应用于渐变接头两端和中间的固化温度值与用于等温固化接头的固化温度相同。使用分析模型来预测破坏载荷并评估渐变接头概念的有效性。在低温(T-g以下)进行后固化的功能梯度接头的强度略有下降,等温固化的接头强度略有增加。随着后固化温度的升高(T-g以上),功能梯度接头的强度类似于等温固化的接头。但是,即使对于最高的后固化温度,功能渐变接头的强度也略高。

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