Ball-grid array packages, or BGAs, have become the preferred IC packaging solution for high-speed and high I/O-count VLSI devices, due in part to their electrical performance and lead density advantages. Device manufacturers looking for increased I/O performance are leveraging differential signaling and advances in sub-micron IC technology that reduce silicon features, IC package size and ball pitch dimensions. As a result, these devices drive PCB designers to develop very-high-density, fabrication-friendly PCB escape routing solutions that meet strict impedance control specifications.
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