Registration Techniques for ADVANCED TECHNOLOGY PCBs

摘要

This article will review all of the essential steps involved in the proper registration of today's advanced technology printed circuits. We've included a registration template that will help PCB manufacturers grade the capabilities within their own factory, and we'll discuss steps needed to improve the aptitude of the systems and processes. The correct registration and alignment of through-holes, blind and buried vias, and soldermask to the innerlayer and outerlayer pads is becoming increasingly difficult with today's tight pitch product, especially on high layer-count boards and/or large form-factor PCs. Include HDI, sequential lamination, via-in-pad and other complex design requirements and you assure a challenge to a facility's registration process.