The Need for PCB Driven I/O Planning

摘要

As I/O counts and power/ground connections continue to increase, the density and pitch of BGA ball patterns are making it increasingly difficult for PCB designers to develop efficient escape strategies. The problem is magnified when traditional chip-driven I/O planning does not consider PCB routing or components when mapping I/Os to BGA balls. The result is increasing cost due to additional layer counts, added complexity and longer design times.