DARPA Funding 'Cool' Electronics Research

摘要

The Defense Advanced Research Projects Agency provided Northrop Grumman's Electronic Systems a $1.7 million contract to develop an ultra high capacity hybrid thermal ground plane to fight semiconductor-generated heat employed in electronic systems. The 18-month contract follows a $1.5 million contract awarded earlier this year to the University of Colorado, Boulder and Lockheed Martin to work on comparable technology. Together, both contracts eventually could be worth about $10 million, says the agency, providing all phases are completed.rnThese agreements come on the heels of a recent Navy report predicting shipboard cooling requirements will double every six years for the next 20 years.