Eliminating Board Defects

摘要

The processes involved in eliminating board defects cut a wide swath through design, fabrication, and even assembly. Along the way, experience and know-how play pivotal roles because solutions to many defect-prone PCB areas are not covered in textbooks. PCB defects run the gamut, for example, from deteriorated RF signals resulting from inappropriate shielding to incorrectly structured boards due to sketchy or ambiguous fabrication notes, and on to miscalculated thermal profiles, creating BGA, CSP or QFN-based solder defects or flaws.