Electroplating: Panel and Pattern Plating, Part 1

摘要

If one thought that electroless copper and other metallization systems were complex, and the deep dark secrets of these systems were shrouded in black magic, this month's discussions on electroplating will seem like brain surgery. In this next series of columns, the intricacies of electrodeposition technology and its function of building up the thickness of copper in the through holes and on the board surface will be pre- sented in detail. The function of the active ingredients in the electrolytic copper plating solutions will be presented. Process control limits for the various plating solution components and the effects on deposit integrity will be discussed.