Improving Circuit Design Using IC Packoge/PCB CO-DESIGN Techniques

摘要

The approach to IC chip packaging design has remained fundamentally unchanged since the 1970s. The chip design team lays out the silicon die and decides what type of IC package to use and how to assign the pinouts. While efforts continue to make co-design of electronic assemblies a reality, no clear communication channel presently exists between the chip and PCB design teams. IC packages are, as the saying goes, simply "tossed over-the-wall" to board designers who are left to deal with whatever comes their way. This is a condition that might well be called "Chip , Packaging 1.0" (FIGURE 1). Since the IC package pinouts are documented in the chipmaker's datasheet, the board designer has no ability to change any aspect of the IC package or to re-map the pinout when necessary. As a result, the board designer has his shoelaces tied when he enters the race to design his product.