Failure Mechanisms in lead-free laminates

摘要

Plated through-hole reliability is influenced by high-density interconnect (HDI) designs and lead-free and mixed-technology (leaded and lead-free solder assembly). HDI adds several new structures to the PTH family, including microvias and buried vias. Microvias can connect to one, two or three layers, can be stacked or unstacked, and filled or unfilled. The subcomposite structures can come with one, two or three subs per composite, often with mixed laminate materials. There are buried vias of various sizes, and these also come in many different forms: blind, core, or sub; filled or unfilled; capped or non-capped.