Interconnect Separation

摘要

Thermal cycle testing analyzes how interconnections fail and what the contributing factors are to those failures. Interconnect separation can be described as a separation between the copper foil on an internal layer and the copper in the barrel of a plated through hole (PTH). Interconnections are typically robust and do not fail in thermal cycle testing, but if the interconnection is weak, a crack can develop between the foil and the barrel of the PTH.