Why Are WLPs So Hot?

摘要

In an era of slower growth and limited investment, wafer-level packages (WLPs) are bucking the trend, with unit volumes expected to top 12.5 billion die this year. What is driving WLP shipments in what for many package types is an otherwise slow year? And what is the impact on major IC package contract assemblers? As end-users continue to strongly prefer small form factor, low-profile consumer products, small packages such as WLPs meet the requirements. Demand for thin packages and greater functionality in smaller spaces drives the increased adoption of WLPs in mobile phones. Cell phone makers are increasing WLP use.