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PROCESSING HIGH FREQUENCY MATERIALS, PART 2

机译:加工高频材料,第2部分

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摘要

The electrical benefits of high frequency materials are well understood. There are, however, a number of fabrication concerns related to the most commonly used high frequency materials. These materials include PTFE (Teflon), PTFE with ceramic fillers and non-PTFE thermoset resin systems with ceramic loading, as well as bonding materials used to make multilayers from these materials. In addition, a newer material, LCP (Liquid Crystalline Polymer), while not as commonly used, offers unique properties that enable evolving PCB applications and several hybrid circuit constructions. LCP also has some specific fabrication guidelines that are differentrnThe high frequency circuit materials that have been used in the industry for the longest period of time are the PTFE materials. Most of these materials are not pure PTFE.
机译:高频材料的电气好处已广为人知。但是,存在许多与最常用的高频材料有关的制造问题。这些材料包括PTFE(聚四氟乙烯),具有陶瓷填料的PTFE和具有陶瓷负载的非PTFE热固性树脂体系,以及用于由这些材料制造多层的粘结材料。此外,一种较新的材料LCP(液晶聚合物)虽然不常用,但具有独特的性能,可支持不断发展的PCB应用和多种混合电路结构。 LCP还具有一些不同的特定制造准则。工业上使用时间最长的高频电路材料是PTFE材料。这些材料大多数不是纯PTFE。

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