RF and PCB have been more or less merging for years, as RF layer and component counts have increased and PCB frequency or clock-rate has been increasing. Prior master-slave mentalities to a successful concurrent flow via IFF failed to deliver the gains as promised. When a true partnering approach is considered, one in which the RF and PCB design teams are perceived and treated as equals, the design itself wins by achieving its performance goals in less time, with fewer headaches and, hopefully, much market success.
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