...
首页> 外文期刊>Printed Circuit Design & Manufacture >PCB Thermal Design DEVELOPMENTS
【24h】

PCB Thermal Design DEVELOPMENTS

机译:PCB热设计发展

获取原文
获取原文并翻译 | 示例

摘要

Electronics thermal management is the discipline of designing electronics systems to facilitate the effective removal of heat from the active surface of integrated circuits to a colder ambient environment. In doing so, heat passes from the package both directly to the surrounding air and via the PCB on which the IC is mounted. The PCB and, to a lesser extent, the surrounding air thermally couple the various heat sources.rnHeat coupling increases as components and PCBs become smaller and more powerful. Designers must take remedial action to bring all components within their respective thermal specifications, but this step is becoming more challenging and constrained, even when preventative measures are taken early in the design process.
机译:电子设备热管理是设计电子系统以促进有效地将热量从集成电路的有源表面转移到较冷的环境中的一门学科。这样做时,热量从封装直接传递到周围的空气,并通过安装了IC的PCB传递。 PCB和周围空气在较小程度上热耦合了各种热源。随着组件和PCB变得越来越小,功能越来越强大,热耦合也会增加。设计人员必须采取补救措施,以使所有组件均符合各自的散热规范,但是,即使在设计过程的早期就采取了预防措施,这一步骤也变得更具挑战性和局限性。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号