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Staying Healthy: The Print Process Checkup, Part 2

机译:保持健康:打印过程检查,第2部分

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I'm Suer Since my last column readers have all their material volume in control, so let's move to the two other areas central to a healthy print process: location and timeliness/repeatability.rnProper alignment of the board and stencil are essential for high-yield printing. So, if experiencing problems with location, evaluate the following inputs:rnBoard and stencil fiducials. When fiducial placement on the board is incorrect, it's generally an etching issue or a plating issue. With etching, if the board is solder mask defined, it comes down to the quality of how the mask was defined and the technique used.
机译:我是Suer,因为我的最后一期读者都控制了所有的材料量,所以让我们转到健康的印刷过程的两个重要中心:位置和及时性/可重复性。产量印刷。因此,如果遇到位置问题,请评估以下输入:rnBoard和模板基准。当在板上的基准放置不正确时,通常是蚀刻问题或电镀问题。通过蚀刻,如果电路板定义为阻焊层,则将取决于掩模的定义方式和所用技术的质量。

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