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The RAPIDLY CHANGING Interconnect

机译:快速更改互连

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摘要

The electronics landscape is changing in ways unforeseen even a few years ago, and the interconnect, or printed circuit board (to use the old definition), is at the forefront of those changes. The underlying technology is changing in ways that few in the West now understand. With huge cost pressures and the shift of basic electronics manufacturing to Asia, these new manufacturing processes have fundamentally altered the topography in ways that present significant opportunities to designers and systems engineers, managers and marketers. These changes are also significant challenges to the relevance of the manufacturing and technology base in North America and Europe.
机译:电子领域正在以甚至几年前无法预料的方式发生变化,而互连或印刷电路板(使用旧定义)处于这些变化的最前沿。根本的技术正在以西方现在很少了解的方式发生变化。伴随着巨大的成本压力以及基础电子制造向亚洲转移,这些新的制造工艺从根本上改变了地形,从而为设计师和系统工程师,经理和营销人员带来了巨大的机遇。这些变化对于北美和欧洲的制造和技术基础的相关性也是重大挑战。

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