Flip Chios Jumped in '10

摘要

Lyon,france - Flip chips made up 13% of all IC packages sold in 2010, and some 29% of the global IC assembly, packaging and test market, a new research report says. But while the new report from Yole Developpe-ment (yole.fr) pegs the flip-chip market at $16 billion, the research firm believes the package style remains in a "growth" phase, with major technology and application and supply-chain transformations looming.