Taiwan Primed for PCB LEADERSHIP

摘要

The technology arc in the interconnect manufacturing industry is once again in motion. Twenty years ago the United States and Western Europe were the sources of innovation in manufacturing processes. New equipment and technologies were developed in cooperation with leading American and European fabricators such as IBM, Hewlett Packard and Cray Research. Independents such as Advanced Circuits for wireless and Photocir-cuits in automotive circuit boards led the way in developing new manufacturing processes. Today, all of those names are history in the interconnect manufacturing business.