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首页> 外文期刊>Printed Circuit Design & Manufacture >True Drop-In Replacement for Oxide Alternatives Debuts Following TSCA Approval
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True Drop-In Replacement for Oxide Alternatives Debuts Following TSCA Approval

机译:TSCA批准后,真正的氧化物替代品首次亮相

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摘要

Uyemura and MEC have introduced an elite oxide alternative for multilayer PWB manufacturing. V-Bond 7710 provides exceptional inner layer adhesion, as well as substantial cost and maintenance advantages compared with conventional oxide alternatives. V-Bond 7710 is regarded as a higher-performing successor to MEC's CZ-2030 for oxide treatment. Materials compatibility has been an obstacle for 2030, and the development and successful testing of V-Bond, which uses a totally new and different chemistry, has now eliminated that roadblock.
机译:Uyemura和MEC推出了用于多层PWB制造的精制氧化物替代品。与传统的氧化物替代品相比,V-Bond 7710具有出色的内层附着力以及显着的成本和维护优势。 V-Bond 7710被认为是MEC的CZ-2030氧化物处理性能更高的后继产品。材料兼容性一直是2030年的障碍,而使用全新化学方法的V-Bond的开发和成功测试现在消除了这一障碍。

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