OFF THE SHELF

摘要

AgENIG (electroless nickel and immersion gold plating over thick film silver) substrates reportedly offer performance advantages when using high-temperature solder. Are said to eliminate solder leaching; enable processing up to 260℃ or higher; permit multiple SMT reflow solder cycles, touchup and repairs. Added Pd plating layer permits Au wire bonding and eutectic die attach. Products can be used up to 170℃ continuous operating temperature. Pattern definition can be held to 0.006" line and spaces.