Pantheon 7.0_02C includes RF and hybrid design flows. Includes 3D viewer; displays stack-up and dielectric layer heights, as defined by the user, with object selection and reporting. Updates via handling; vias and via arrays can be added to board, block, or component geometries; provides automatic via stitching along a manually drawn line or on the interior or exterior of selected objects. Wire shielding and ground shielding are no longer manual procedures. Vias can be automatically generated with or without DRC checking.
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