首页> 外文期刊>Printed Circuit Design & Manufacture >PRINTING MINIATURIZED DEVICES FOR THE AUTOMOTIVE AND INDUSTRIAL MANUFACTURING SECTORS
【24h】

PRINTING MINIATURIZED DEVICES FOR THE AUTOMOTIVE AND INDUSTRIAL MANUFACTURING SECTORS

机译:打印用于汽车和工业制造部门的微型设备

获取原文
获取原文并翻译 | 示例
       

摘要

The purpose of this investigation was to determine whether 0.4mm CSP devices can be effectively printed within automotive and industrial assembly environments. As considered throughout this work, the issue of printing 0.4mm CSP-compatible apertures through the established 127μm stencil foil thickness leads to an infringement of industry-recognized area ratio rules. Therefore, this investigation focused around the possibility of breaking these established area ratios with no detrimental effect on standard depositions.
机译:这项调查的目的是确定在汽车和工业装配环境中能否有效印刷0.4mm CSP器件。正如在整个工作中所考虑的那样,通过既定的127μm模板箔厚度印刷0.4mm CSP兼容孔的问题导致违反了行业公认的面积比规则。因此,这项研究集中在打破这些既定面积比而对标准沉积没有不利影响的可能性上。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号