Shielding Effectiveness of Polyimide Tape during Rework

摘要

Through repeated measurement of maximum outlying component temperatures during the reflow process, Kapton tape proved worst in terms of effectiveness of the typical shielding materials tested. Surprisingly, the clay/water gel, which is unproven in the electronics industry in terms of material compatibility and remnant ionic residue, was determined to be the best performing heat-shield material. More testing is needed, as it is currently an unproven material. The second-best shield material that can be applied with polyimide tape was the ceramic fiber material. The next closest performing materials were, in order, copper tape, stainless steel shields, and finally Kapton tape.