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Dodging the 'Obsolete' Bullet

机译:躲过“过时”的子弹

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摘要

As much as we are mesmerized by the paradigm-breaking, over-the-top, deal-breaking new thing, more often than not it's the low-key evolution of tried-and-true technologies that are truly amazing. Examples abound. When HDI technology was first bandied about, it seemed the deal-breaker. Yes, we all intuitively knew that advanced technology was demanding more functionality in less real estate, but still, holes that small - and all that went with them! Not many years later, just about every printed circuit board sports some aspect of HDI. Lines and spaces of once unthinkable size are now common. Miniature vias are being drilled using conventional mechanical drilling equipment, as well as with lasers. Plating technology has evolved to a much more refined level, as has the advent of conductive and nonconductive filled vias, etc. The once unthinkable is now built with tried-and-true equipment and processes, albeit significantly tweaked, once thought to be inconceivable for producing such advanced technology.
机译:尽管我们被打破范式,突破顶峰,打破交易的新事物所迷住了,但往往是经过实践检验的技术的低调演变才是真正令人惊奇的。例子比比皆是。当HDI技术首次出现时,它似乎是破坏者。是的,我们所有人都凭直觉知道先进的技术要求占用更少空间的更多功能,但是仍然存在很小的漏洞-所有这些都伴随着它们!不久之后,几乎每一个印刷电路板都采用了HDI的某些方面。曾经无法想象的线条和空间现在很常见。微型通孔使用常规机械钻孔设备以及激光进行钻孔。电镀技术已经发展到更加完善的水平,导电和非导电填充通孔的出现等也应运而生。曾经无法想象的现在已经通过久经考验的设备和工艺进行了构建,尽管经过了重大调整,但曾经被认为是无法想象的。产生这样的先进技术。

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