In the latest issue of the Global Semiconductor Packaging Materials Outlook, organic substrate represents more than one-third of the semiconductor materials market. The main reason for this high value is the growth of flip-chip substrates, which are typically more expensive than wirebond packages. While there has been tremendous price pressure in the packages used in the PC industry as a result of falling demand for PCs and the expansion of capacity, the growth in flip-chip CSP (FC-CSP) substrates is making up for the slower FC-PBGA dollar value growth. The expansion of FC-CSPs with laminate substrates is driven by explosive growth in mobile computing and communications devices such as smartphones and tablets. Will this growth continue? What are the future requirements for these substrates? What do the other markets for organic substrates look like? Are there opportunities in the 2.5D market for organic substrates?
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