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Via-in-Pad -Why and How

机译:Via-in-Pad-为什么和如何

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摘要

There are many reasons you shouldn't use via-in-pad. It's not good practice, and those via holes act like little capillary straws and suck solder off the pad or the BGA (FIGURE 1). That said, there are some applications that may require - or seem to require - via-in-pad. Here are a few examples of why you might need to use via-in-pad: 1. There is not enough space on the board. 2. It can help with thermal management. 3. Trace routing may be easier with via-in-pad when component spacing is tight. 4. High-frequency designs benefit from the shortest possible routing to bypass capacitors, which may indicate via-in-pad.
机译:有许多原因不应该使用“ in-pad”。这不是一个好习惯,这些通孔的作用就像小毛细吸管,并从焊盘或BGA上吸走焊料(图1)。就是说,有些应用程序可能需要-或似乎需要-通孔填充。以下是一些您可能需要使用通孔的示例:1.板上的空间不足。 2.它可以帮助进行热管理。 3.当元件间距狭窄时,使用焊盘内走线可能更容易进行走线布线。 4.高频设计得益于尽可能短的旁路电容布线,这可能表示焊盘过孔。

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