3D Layer Stacking, TSV to Replace DDR, Report Says

摘要

Lyon, france - Many expect current DDR, both the computer variety (DDR3/ DDR4) and the mobile variety (LPDDR3/LPDDR4), to reach the end of their road soon, as the DDR interface reportedly cannot run at data rates higher than 3.2Gbps in a traditional computer main memory environment. Thus several new DRAM memory architectures based on 3D layer stacking and TSV have evolved to carry memory technology forward, explains research group Yole Developpement in its recently released report on 3D ICs titled "3DIC & 2.5D TSV Interconnect for Advanced Packaging - 2014 Business Update."