off the SHELF

摘要

Talon 3 allows plating directly onto copper. Paves way for EPIG. Developed for applications that cannot tolerate Ni (medical sensors; flexible circuits; electronic products that cannot use Ni due to problems related to magnetics and frequency, and high-frequency circuitry). Deposits electro-less/autocatalytic Pd that is solderable and gold-wire bondable. Bath has low Pd metal content. EPIG finish solders after 8 hr. steam aging.