Off the SHELF

摘要

APT-1400F-SL-A flying probe test system for PCBAs delivers larger testing area (635 × 610mm) to accommodate 5G communications and battery management system applications. SL series provides 48% larger test area; A series designation (inline configuration model) enables automatic transfer of UUT. Automated conveyor. Loctite Ablestik ABP 8068TD high thermal die attach paste is for use in applications where no die back-side metallization is required. Is for bare silicon die integration and high-power applications. Dissipates heat in applications where bare silicon die are used. Bulk thermal conductivity of 50 W/m-K.