off the SHELF

摘要

2Di-LU1 inline bottom-side AOI captures entire image of 460 × 500mm PCBA and carriers of 610 × 610mm in one pass. Eliminates board flipping and handling. Inspects for copper exposure, pin detection, pin-holes, solder fillet abnormalities, missing components, soldering problems, and bridges. FlexTRAK-SHS includes 585 in3 large-volume process chamber configurable for larger strips, or can treat more strips per cycle, for higher throughput for lead frames, high-density substrates, and other strip-type components. Performs pre-underfill plasma treatment on flip-chip packages, removal/reduction of oxidation on lead frames, etc.