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U of I Researchers Demonstrate New Capability for Electronics Cooling Using Additive Manufacturing

机译:一位I研究人员展示了使用增材制造进行电子冷却的新功能

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摘要

URBANA, IL - For decades, researchers have considered the potential for cooling hot electronic devices by blowing on them with high-speed air jets. However, air jet cooling systems are not widely used today. Two of the biggest obstacles that prevent the use of these systems is their complexity and weight. Air jet systems must be made of metal to be able to handle the pressure associated with air jets whose speed can exceed 200 miles per hour. And the air handling system can be complex with many discrete components that manage the air flow and direct the air onto the hot spots where cooling is required.
机译:伊利诺伊州乌尔巴纳-数十年来,研究人员一直在考虑通过用高速喷气机吹热电子设备来冷却它们的潜力。但是,空气喷射冷却系统今天并未广泛使用。阻止使用这些系统的两个最大障碍是它们的复杂性和重量。喷气系统必须由金属制成,以便能够承受与时速超过200英里的喷气相关的压力。而且,空气处理系统可能具有许多分立的组件,这些组件可以管理气流并将空气引导至需要冷却的热点,因此非常复杂。

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