No Dice on 'Chiplets'

摘要

WHEN I first started in electronics back in 1991, through-hole was still dominant and SMT was just taking hold. It wasn't long after, however, when we began hearing about mul-tichip modules, or MCMs. Conferences sprung up, publishers dedicated entire issues to the subject, and trade groups started writing standards. And then ... not much. MCMs never became the dominant packaging style some analysts predicted.