首页> 外文期刊>Printed Circuit Design & Manufacture >Neo Tech Releases New LTCC & AIN Design Guidelines
【24h】

Neo Tech Releases New LTCC & AIN Design Guidelines

机译:Neo Tech发布新的LTCC和AIN设计指南

获取原文
获取原文并翻译 | 示例
       

摘要

Neo Tech has published new and expanded guidelines for the manufacture of low-temperature co-fired ceramic (LTCC) and aluminum nitride (AIN) packages. Neo Tech, which is a leading manufacturer of LTCC and high-temperature co-fired (HTCC) substrates and packages, says the technologies provide unique solutions for high interconnect density, compact packages and high-frequency applications. Such packages can be used for embedded passive components, HDI, and plated silver systems. The hermetic packaging aids long-term reliability.
机译:Neo Tech已发布有关制造低温共烧陶瓷(LTCC)和氮化铝(AIN)封装的新指南和扩展指南。 Neo Tech是LTCC和高温共烧(HTCC)基板和封装的领先制造商,该技术表示,这些技术为高互连密度,紧凑封装和高频应用提供了独特的解决方案。这种封装可用于嵌入式无源元件,HDI和镀银系统。密封包装有助于长期可靠性。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号