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01005 Termination Lift

机译:01005端接升降机

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THIS MONTH WE show soldering of 01005 chip resistors from an early project with lead-free assembly. The microsection image in FIGURE 1 shows a few issues, but it's the circles in both joints that caught my eye. Yes, they are voids before they are unmasked. During sectioning we stopped just before entering the void. Most would have continued a few more micros to remove the thin sliver of solder, which was the wall of the void, to show the void. But everyone has seen voids before! Now to the important part. The pad size is too large for this small passive device and contributed to the addition of too much paste during printing. The length of the pad was reduced in further trials. During soldering, solder reflowed and wet over the top of the resistor termination. This resulted in lifting of the wraparound termination on both sides.
机译:本月我们展示了早期项目中采用无铅组装的01005片式电阻器的焊接。图1中的显微切片图像显示了一些问题,但引起我注意的是两个关节中的圆圈。是的,它们在被掩盖之前是空白的。在切片期间,我们就在进入空隙之前停了下来。大多数人会继续使用更多的微米,以去除焊料的细条(即空隙的壁)以显示空隙。但是每个人以前都看到过虚空!现在到重要部分。对于这种小型无源设备,焊盘尺寸太大,导致在打印过程中添加了过多的糊剂。垫子的长度在进一步的试验中减少了。焊接期间,焊料在电阻端子的顶部回流并浸湿。这导致两侧缠绕端子的抬起。

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