THE CURRENT CONSUMER electronics manufacturing climate, which dictates thinner boards and stencils, component placements right to the very edge and panelized assemblies with a significant amount of routing, makes it increasingly challenging to ensure board flatness and coplanarity for a good stencil printing outcome. But, as you know from reading this column regularly, one fact is nonnegotiable: Good printing results require a tight stencil-to-board gasket across the whole of the panel. (See "For Successful Printing, Don't Blow the Gasket," October 2018.) This requires the PCB to be flat.
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