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Hybrid Design of Modular Multilevel Converters for HVDC Systems Based on Various Submodule Circuits

机译:基于各种子模块电路的高压直流输电系统模块化多电平转换器的混合设计

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摘要

The modular multilevel converter (MMC) has become the most promising converter technology for high-voltage direct current (HVDC) transmission systems. However, similar to any other voltage-sourced converter-based HVDC system, MMC-HVDC systems with the half-bridge submodules (SMs) lack the capability of handling dc-side short-circuit faults, which are of severe concern for overhead transmission lines. In this paper, two new SM circuit configurations as well as a hybrid design methodology to embed the dc-fault-handling capability in the MMC-HVDC systems are proposed. By combining the features of various SM configurations, the dc-fault current path through the freewheeling diodes is eliminated and the dc-fault current is enforced to zero. Several MMC configurations based on the proposed hybrid design method and various SM circuits, that is, the half-bridge, the full-bridge, the clamp-double, and the five-level cross-connected SMs, as well as the newly proposed unipolar-voltage full-bridge and three-level cross-connected SMs, are investigated and compared in terms of the dc-fault-handing capability, semiconductor power losses, and component requirements. The studies are carried out based on time-domain simulation in the PSCAD/EMTDC software environment for various SM configurations and dc-fault conditions. The reported study results demonstrate the proposed hybrid-designed MMC-HVDC system based on the combination of the half-bridge and the proposed SM circuits is the optimal design among all evaluated systems in terms of the dc-fault-handing capability, semiconductor power losses, and component requirements.
机译:模块化多电平转换器(MMC)已成为用于高压直流(HVDC)传输系统的最有希望的转换器技术。但是,与任何其他基于电压源的基于转换器的HVDC系统相似,具有半桥子模块(SM)的MMC-HVDC系统缺乏处理dc侧短路故障的能力,这对于架空输电线路而言是极为重要的。在本文中,提出了两种新的SM电路配置以及在MMC-HVDC系统中嵌入直流故障处理能力的混合设计方法。通过组合各种SM配置的功能,消除了通过续流二极管的直流故障电流路径,并将直流故障电流强制为零。基于提出的混合设计方法和各种SM电路的几种MMC配置,即半桥,全桥,钳位双和五级交叉连接的SM,以及新提出的单极在直流故障处理能力,半导体功率损耗和组件要求方面,对全电压和三电平交叉连接的SM进行了研究和比较。这些研究是基于PSCAD / EMTDC软件环境中针对各种SM配置和直流故障条件的时域仿真而进行的。报告的研究结果表明,基于半桥和SM电路的组合,提出的混合设计MMC-HVDC系统在直流故障处理能力,半导体功率损耗方面是所有评估系统中的最佳设计。 ,以及组件要求。

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