樹脂めっきにおける密着強度の発現ほ接着現象であることに注目し，ABS樹脂めっきに対すrnる分子接着技術の応用展開を試みた．分子接着剤として1分子中にジチオールトリアジニル基とトリエトrnキシシリル基を有する6-（3-トリエトキシシリルプロピルアミノ）-1，3，5-トリアジン-2，4-ジチオールモノソrnジウム塩（TES）を用いた．TESがABS樹脂と反応できるようにコロナ放電処理を行い，ABS樹脂表面をrnOH化した．ABS樹脂のOH化濃度はコロナ放電中の湿度とともに増加した．得られたOH化ABS樹脂rnはTES溶液中で処理すると，樹脂表面に接着性が付与された．TES結合ABS樹脂は触媒担持の過程でrnS-Pd結合が生成した．触媒担持ABS樹脂は無電解銅めっきおよび電気銅めっきを経て銅はくが形成されrnた．はく離強度はTES処理条件と結合構造の影響を受け，樹脂層破壊が起こるはど高い値が得られた．%Based on idea that the expression of adhesion strength between metals and resins in resin plating is an adhesion phenomenon, the plating of ABS resin has been investigated using 6-(3triethoxysilylpropylamino)-1,3,5-triazine-2,4-dithiol monosodium (TES) as a molecular adhesive. Firstly, ABS resin was treated with corona discharge apparatus to give OH groups on the resin surfaces, which react readily with the triethoxysilyl groups in TES. The OH concentration on ABS resin surfaces increased with relative humidity in corona discharge treatment. On immersing ABS resin with OH groups into TES solution, an adhesion property is created on ABS resin surfaces. XPS surface analysis confirms that TES-bonding ABS resin has S-Pd bonds in the process of catalyst supporting. ABS resin/copper film products obtained after copper electroless plating following copper electroplating gave very high peel strength as well as resin layer fracture in peeling tests.
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