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Chemical and structural changes at the ABS polymer—copper metal interface

机译:ABS聚合物-铜金属界面的化学和结构变化

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Creating oxygen containing moieties (hydroxyl or carbonyl) on polymer substrate surfaces is known to increase the adhesion strength of polymers to metals. However, we noticed adhesion increase with time even though no pre- or post-treatment of the polymer substrate was done. In the case of sputtered and galvanically strengthened copper coatings on acrylonitrile—butadiene—styrene polymer (ABS) substrate, the adhesion strength increased from approximately 6 J/m~2 to 53 J/m~2 during a 1008-h period. During this period structural and chemical changes of the polymer near the interface take place. Carbonyl functionalities developed on the ABS surface are most likely responsible for fee large increase in the adhesion strength. Chemical changes of the polymer are probably a consequence of the galvanic deposition and a close contact of ABS with copper which is known to facilitate the oxidation of ABS.
机译:已知在聚合物基材表面上产生含氧部分(羟基或羰基)可增加聚合物对金属的粘合强度。但是,我们注意到,即使未对聚合物基材进行任何预处理,粘附力也会随着时间而增加。对于在丙烯腈-丁二烯-苯乙烯聚合物(ABS)基材上进行溅射和电电镀的铜涂层,在1008小时内,粘合强度从约6 J / m〜2增加到53 J / m〜2。在此期间,界面附近的聚合物发生结构和化学变化。在ABS表面上形成的羰基官能团最有可能导致粘合强度大大提高。聚合物的化学变化可能是电流沉积和ABS与铜紧密接触的结果,众所周知,铜可以促进ABS的氧化。

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