Thermal stability of boron-containing phenol formaldehyde resin

摘要

The boron-containing phenol-formaldehyde resin derived from phenol, formaldehyde and boric acid was synthesized. The mechanisms of synthesis and curing reactions were investigated by infrared spectroscopy and chemical analysis. The kinetics of thermal degradation and thermal stability were determined by thermal analysis. The results show that the resin has higher heat oxidation resistance than common phenol-formaldehyde resins. In addition, the fiberglass-reinforced laminate has good mechanical and electric properties.