首页> 外文期刊>Physical review >Thermoelectric figure of merit of (In_(0.53)Ga_(0.47)As)_(0.8)(In_(0.52)Al_(0.48)As)_(0.2) III-V semiconductor alloys
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Thermoelectric figure of merit of (In_(0.53)Ga_(0.47)As)_(0.8)(In_(0.52)Al_(0.48)As)_(0.2) III-V semiconductor alloys

机译:(In_(0.53)Ga_(0.47)As)_(0.8)(In_(0.52)Al_(0.48)As)_(0.2)III-V半导体合金的热电性能因数

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摘要

The thermoelectric figure of merit is measured and theoretically analyzed for n-type Si-doped InGaAlAs III-V quaternary alloys at high temperatures. The Seebeck coefficient, electrical conductivity, and thermal conductivity of a Si-doped (In_(0.53)Ga_(0.47)As)_(0.8)(In_(0.52)Al_(0.48)As)_(0.2) of 2 μm thickness lattice matched to InP substrate grown by molecular-beam epitaxy are measured up to 800 K. The measurement results are analyzed using the Boltzmann transport theory based on the relaxation-time approximation and the theoretical calculation is extended to find optimal carrier densities that maximize the figure of merit at various temperatures. The figure of merit of 0.9 at 800 K is measured at a doping level of 1.9 × 10~(18) cm~(-3) and the theoretical prediction shows that the figure of merit can reach 1.3 at 1000 K at a doping level of 1.5 × 10~(18) cm~(-3).
机译:对高温下的n型Si掺杂InGaAlAs III-V四元合金的热电性能进行了测量并进行了理论分析。厚度为2μm的Si掺杂(In_(0.53)Ga_(0.47)As)_(0.8)(In_(0.52)Al_(0.48)As)_(0.2)的塞贝克系数,电导率和导热率与分子束外延生长的InP衬底匹配的材料的测量范围高达800K。使用基于弛豫时间近似的玻尔兹曼输运理论分析测量结果,并扩展了理论计算以找到最佳载流子密度,从而最大化了在各种温度下都有优点。在1.9×10〜(18)cm〜(-3)的掺杂水平下测得的品质因数为0.9,理论预测表明,在1000 K的掺杂水平下,品质因数可以达到1.3。 1.5×10〜(18)厘米〜(-3)。

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  • 来源
    《Physical review》 |2010年第23期|P.235209.1-235209.6|共6页
  • 作者单位

    Department of Electrical and Computer Engineering, University of California, Santa Barbara, California 93106, USA;

    rnElectrical Engineering Department, University of California, Santa Cruz, California 95064, USA;

    Electrical Engineering Department, University of California, Santa Cruz, California 95064, USA;

    Materials Science and Engineering Department, University of Delaware, Newark, Delaware 19716, USA;

    rnDepartment of Electrical and Computer Engineering, University of California, Santa Barbara, California 93106, USA Materials Department, University of California, Santa Barbara, California 93106, USA;

    rnDepartment of Mechanical Engineering, University of California, Berkeley, California 94720, USA;

    rnDepartment of Mechanical Engineering, University of California, Berkeley, California 94720, USA;

    rnDepartment of Electrical and Computer Engineering, University of California, Santa Barbara, California 93106, USA;

    rnDepartment of Mechanical Engineering, University of California, Berkeley, California 94720, USA;

    rnMaterials Department, University of California, Santa Barbara, California 93106, USA;

    rnElectrical Engineering Department, University of California, Santa Cruz, California 95064, USA;

    Department of Electrical and Computer Engineering, University of California, Santa Barbara, California 93106, USA;

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  • 正文语种 eng
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  • 关键词

    thermoelectric, electrogasdynamic and other direct energyrnconversion; thermoelectric effects; Ⅲ-Ⅴ semiconductors;

    机译:热电;气动力和其他直接能量转换;热电效应Ⅲ-Ⅴ族半导体;

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