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Impedance measurement for microstructure characterization and internal surface estimation of macroporous silicon

机译:大孔硅的微结构表征和内表面估计的阻抗测量

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摘要

In this paper, a simple and convenient method based on impedance measurement has been proposed for the first time to evaluate the average porosity, pore radius, and internal surface area of macroporous silicon structure fabricated by electrochemical method. The porosity and the average pore radius have been obtained by developing a geometrical model and applying the generalized effective medium approximation theory to the dc and ac impedance measurement of both unoxidized and thermally oxidized macroporous silicon. The internal surface area per unit volume is then computed from the porosity and the pore radius using the same model. The method has been applied to a wide range of porosity from 30 to 58% fabricated on p-type silicon with a resistivity of 10-20 fl cm. Experimental verification of porosity, mean pore radius, and internal surface area have been performed by standard gravimetric technique and by top-view and cross-section SEM imaging, respectively. A typical mean pore radius, porosity, and internal surface area of a macroporous silicon sample has been obtained to be 1.52 μm, 54.2%, and 3565.7 cm~2/cm~3, respectively, from the impedance measurement and 1.5 μm, 55%, and 3666.7 cm~2/cm~3 from SEM and gravimetric analysis which shows that the results are within 2% of the values obtained by conventional methods. The advantages of this method over the other recently reported techniques for similar characterization have been discussed.
机译:本文首次提出了一种基于阻抗测量的简便方法,用于评价电化学法制备的大孔硅结构的平均孔隙率,孔半径和内表面积。通过建立几何模型并将广义有效介质近似理论应用于未氧化和热氧化的大孔硅的直流和交流阻抗测量,可以获得孔隙率和平均孔半径。然后使用相同的模型由孔隙率和孔半径计算出每单位体积的内表面积。该方法已被应用到在10到20厘米3的电阻率的p型硅上制造的从30%到58%的孔隙率。孔隙率,平均孔隙半径和内表面积的实验验证分别通过标准重量技术以及俯视和截面SEM成像进行。根据阻抗测量,大孔硅样品的典型平均孔半径,孔隙率和内表面积分别为1.52μm,54.2%和3565.7 cm〜2 / cm〜3,而1.5μm,55% ,扫描电镜和重量分析得到3666.7 cm〜2 / cm〜3,结果与常规方法所得结果相差2%以内。已经讨论了该方法相对于其他最近报道的用于类似表征的技术的优势。

著录项

  • 来源
    《Physica status solidi》 |2010年第9期|p.2137-2143|共7页
  • 作者单位

    Department of Electronics and Telecommunication Engineering, Bengal Engineering and Science University, Shibpur,Botanic Garden, Howrah 711103, India;

    School of Materials Science and Engineering, Bengal Engineering and Science University, Shibpur, Botanic Garden,Howrah 711103, India;

    School of Materials Science and Engineering, Bengal Engineering and Science University, Shibpur, Botanic Garden,Howrah 711103, India;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    impedance; microstructure; porous silicon;

    机译:阻抗;微结构;多孔硅;

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