High-performance copper mesh transparent flexible conductors based on electroplating with vacuum-free processing

摘要

Highly reliable Cu micron network transparent film on flexible polyethylene terephthalate (PET) substrate, which has excellent conductivity, improved thermostability and enhanced adhesion is prepared via electroplating and lithography without high temperature and vacuum environment. The sheet resistance of the Cu micron network flexible films obtained by this work is ～2.0Ω/sq with the transmittance of ～86%, and almost unchanged in the peeling strength of 4.0 MPa. The fabricated Cu micron network establishes strong adhesion to PET substrates, thus mechanical stability against taping and compressive bending is attainable. Moreover, the Cu micro network films show a good stability to resist long-term storage and high temperature (300 °C). The thermal performance of the Cu micro network films as visible transparent heaters via Joule heating is also demonstrated. In addition, good durability and flexibility are also found by being dressed in the human body while maintaining the excellent performance.