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Non-contact and non-destructive testing of silicon V-grooves: A non-medical application of optical coherence tomography (OCT)

机译:硅V型槽的非接触式和非破坏性测试:光学相干断层扫描(OCT)的非医学应用

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摘要

The paper reports a non-medical optical coherence tomography (OCT) application namely, the use of OCT to test a micro-electro-mechanical systems (MEMS) technology device. The OCT system used in this initial study combined a fibre Michelson interferometer and a 10 mW 1300 nm super luminescent diode (SLD). The system supported a measured depth resolution of 21 pm as well as a transverse resolution of around 3 mu m. As a first demonstration, the depth and width of a MEMS V-shaped groove in silicon were measured to within 7% (6%) and 12% (14%) of the values determined by stylus contacting (standard microscopy) method, respectively. The OCT technique combines advantages of non-contact, non-invasive and non-destructive operation making it suitable for on-line precision measurement of V-shaped grooves in silicon. (c) 2005 Elsevier Ltd. All rights reserved.
机译:该论文报告了一种非医学光学相干断层扫描(OCT)应用,即使用OCT测试微机电系统(MEMS)技术设备。在此初始研究中使用的OCT系统将光纤迈克尔逊干涉仪和10 mW 1300 nm超发光二极管(SLD)结合在一起。该系统支持测得的深度分辨率为21 pm,横向分辨率约为3微米。作为第一个演示,测量的硅中MEMS V形凹槽的深度和宽度分别在通过触笔接触(标准显微镜)方法确定的值的7%(6%)和12%(14%)之内。 OCT技术结合了非接触,非侵入性和非破坏性操作的优势,使其适用于硅中V形凹槽的在线精密测量。 (c)2005 Elsevier Ltd.保留所有权利。

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