Mid-infrared integrated optics: versatile hot embossing of mid-infrared glasses for on-chip planar waveguides for molecular sensing

摘要

The versatility of hot embossing for shaping photonic components on-chip for mid-infrared (IR) integrated optics, using a hard mold, is demonstrated. Hot embossing via fiber-on-glass (FOG), thermally evaporated films, and radio frequency (RF)-sputtered films on glass are described. Mixed approaches of combined plasma etching and hot embossing increase the versatility still further for engineering optical circuits on a single platform. Application of these methodologies for fabricating molecular-sensing devices on-chip is discussed with a view to biomedical sensing. Future prospects for using photonic integration for the new field of mid-IR molecular sensing are appraised. Also, common methods of measuring waveguide optical loss are critically compared, regarding their susceptibility to artifacts which tend artificially to depress, or enhance, the waveguide optical loss.